Simon Grosse Detectors based on SPAD technology offer a high time resolution and sensitivity for applications that require time-resolved single-photon measurements. The integration of SPADs into the CMOS process (CSPAD) allows for efficient on-chip signal processing and high flexibility for custom detector designs. Fraunhofer IMS endeavors include active research and development in the fields of LiDAR, Quantum Imaging, microscopy, spectroscopy and more. The approach of utilizing a wafer-to-wafer bonding process with a backside-illuminated CSPAD wafer and a read-out wafer will enable significant improvements of the detector performance as well as the possibility of combining different technologies.
